TSMC confirms volume shipments of 16nm, pushes EUV back to the 5nm node

TSMC-Fab
TSMC has announced that it’s shipping 16nm chips in volume, with a rapid 10nm ramp on the way. EUV, however, has been pushed back again, and is now expected to debut on the 5nm node.

The original article can be found here: http://www.extremetech.com/extreme/210427-tsmc-confirms-volume-shipments-of-16nm-pushes-euv-back-to-the-5nm-node

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Micron announces new, 16nm TLC NAND: Will it have better luck than Samsung?

NAND
Micron has announced that it intends to offer a 16nm TLC NAND for consumer SSDs starting this fall. After the troubles Samsung has had and with 3D NAND already ramping, it’s not clear where the company will market the new drives.

The original article can be found here: http://www.extremetech.com/computing/207456-micron-announces-new-16nm-tlc-nand-will-it-have-better-luck-than-samsung

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TSMC announces its first 16nm FinFET networking chip: 32-core ARM Cortex-A57

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Yesterday, TSMC announced the first successful production of a 32-core ARM chip based on 16nm FinFET technology. According to the foundry, it collaborated with HiSilicon technologies to create the network processor, which marries a 16nm 32-core ARM Cortex-A57 with 28nm logic and I/O chips — this 16nm/28nm combination is produced using a technique TSMC calls CoWoS (Chip-on-Wafer-on-Substrate).

The original article can be found here: http://www.extremetech.com/computing/190941-tsmc-announces-its-first-16nm-finfet-networking-chip-32-core-arm-cortex-a57

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