Intel’s next-gen Xeon Phi will be 3x faster, include next-gen Hybrid Memory Cube tech

22nm silicon die and wafer (Intel, Knights Ferry)
Intel’s next-generation Knights Landing is going to pack a huge number of advances, from hyper memory cube technology to a new fabric Interconnect and next-generation 14nm Atom cores.

The original article can be found here: http://www.extremetech.com/extreme/185007-intels-next-gen-xeon-phi-will-be-3x-faster-include-next-gen-hybrid-memory-cube-tech

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